3D packaging is becoming an emerging technology for high density and high speed device development.

Chip scale bonding using bumps or pillars, instead of wire bonding, is becoming the main stream in packaging technology.

IMAT has started to offer customers thick resist patterning on UBM (Under Bump Metal) for 300mm wafers. Cu/Ti for Cu bump and Au/Ti for Au bump are standard UBM. Resist thickness is standardized to 45um and 80um. IMAT also has a standard mask set for bump patterning.  This mask has 50um, 75um, 100um, and 150um diameter holes through it. If a customer needs a specific mask pattern, IMAT can provide it at a reasonable cost withint a short period of time.