Thick Resist Patterning
3D packaging is an emerging technology for high density and high speed device development. Chip scale bonding using bumps or pillars, instead of wire bonding, is becoming a main stream packaging technology. IMAT has started to offer customers thick resist patterning on UBM (Under Bump Metal) for 300mm wafers. Cu/Ti for Cu bump and Au/Ti for Au bump are standard UBM. Resist thickness is standardized to 40um and 70um. IMAT also has a standard mask set for bump patterning. This mask has 50um, 75um, 100um, and 150um diameter holes through it. If a customer needs a specific mask pattern, IMAT can provide it at a reasonable cost within a short period of time. For electroplating of bump metal on wafer diameters of 150mm or smaller, the purchase of a mask for the specified wafer size is recommended.
Get Your Wafers Faster
We know that time is money, that's why we don't waste any of it. With short lead times and around the clock processing, you can rest assured your order will be ready when you need it.