We offer an extensive assortment of metals for deposition, including: Ta, TaN, Cu, Ti, TiN, Al, Al-Si-Cu, Al-Cu, Al-Si, TiW, W, WN, WSi, Cr , Ru, Pd, Pt, Au, Ag, Ni, Co, a-Si, NiSi, and Cu
By integrating process capabilities already available from IMAT, the addition of thick resist patterning capabilities has allowed us to start fabrication and shipment of Bump Resist Patterned and RDL Resist Patterned wafers to customers.
With short cycle times and competitive service charges if your in a rush we\'re here to help. Our typical lead time is 7 days or less. We also offer expedite services for those last minute orders you need now.