3D packaging is an emerging technology for high density and high speed device development. Chip scale bonding using bumps or pillars, instead of wire bonding, is becoming a main stream  packaging technology. IMAT offers customers thick dry resist film patterning on UBM (Under Bump Metal) for 200mm and 300mm wafers. Cu/Ti for Cu bump and Au/Ti for Au bump are standard UBM. Resist thickness is standardized to 20um through 120um by pre-determined steps. IMAT also has several set for bump patterning. If a customer needs a specific mask pattern, IMAT can provide it at a reasonable cost within a short period of time.